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6 inch DIE SAW processing wafer cassette

6 inch DIE SAW processing wafer cassette

Sold by Shenzhen Dong Hong Xin industrial (Hong Kong) Co., Ltd
DIE SAW processing technology is to cut and slice a complete wafer into a grain of grain, which is convenient for the next process. In the process of cutting the dicing, a carrier must be provided to carry out the storage of the cut wafer. The 6 inch DIE SAW processing wafer cassette can do this
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Product details

Product specifications

Place of origin China

Product description

DIE SAW processing technology is to cut and slice a complete wafer into a grain of grain, which is convenient for the next process. In the process of cutting the dicing, a carrier must be provided to carry out the storage of the cut wafer. The 6 inch DIE SAW processing wafer cassette can do this daunting task well.

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6 inch DIE SAW processing wafer cassette

Company details

About the company

Primary products
Wafer Cassettes, Wafer frames & Carriers
Year established
2003
Business type
Manufacturer
Number of employees
11-50
Bikudo member since
Jun 2019
Shenzhen Dong Hong Xin industrial (Hong Kong) Co., Ltd was founded in 2003. Specializing in the production of electronic industry revolving storage series products and other metal products.

Supplier contact details

Shenzhen Dong Hong Xin industrial (Hong Kong) Co., Ltd
1st Floor, Building 12, Wanfeng Dayangtian Industrial Zone, Shajing Street, Baoan District, Shenzhen, Guangdong, 518000, China
Call: 13826547148